Onishi, Genki (The University of Tokyo), Naoki, Yuto (The University of Tokyo), Kamiya, Manto (The University of Tokyo), Fujimoto, Hiroshi (The University of Tokyo), Kitano, Toyokazu (DAIHEN Corporation), Soga, Yukisato (DAIHEN Corporation), Suto, Yoshihiro (DAIHEN Corporation)

Transient Trajectory Improvement of Wafer Transfer Robot Using Iterative Learning Control with Command Conversion Filter

Scheduled for presentation during the Regular Session "Robotics for Industry 4.0" (FrBT3), Friday, July 18, 2025, 14:40−15:00, Auditorium

Joint 10th IFAC Symposium on Mechatronic Systems and 14th Symposium on Robotics, July 15-18, 2025, Paris, France

This information is tentative and subject to change. Compiled on August 2, 2025

Abstract

In semiconductor manufacturing processes, high-speed and high-precision operation is critical for improving throughput. Among various types of wafer transfer robots, a robot type equipped with Direct-Drive(DD) motors and long shafts with steel belts has been attracting attention because of its compactness in recent years. This type of robot has a problem of meandering motion in the wafer transfer path due to the torsion of the shaft. In this study, transient vibration suppression of wafer transfer equipment was achieved by frequency domain Iterative Learning Control (ILC). Furthermore, to reduce the number of learning trials, the command conversion filter considering the dynamics difference between the load side and the motor side was designed based on a two-inertia model.